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Sizzix Die Brush and Foam Pad for Wafer-Thin Dies

£7.00
£7.00
Check availability in store
Free UK delivery for orders over £20.
Order by 8pm for Standard Delivery within 3 working days
Click and Collect (order by 8pm Sunday-Thursday, collect in two days)
International delivery available
FREE returns
0330 026 1400 - Telephone ordering now available

Product description

It’s never been easier to brush away your paper pieces than with the Sizzix Die Brush and Foam Pad for Wafer-Thin Dies! Create unique, intricate papercraft designs and then use this set to effortlessly remove the excess paper from your dies. This product will do the trick with all brands of wafer-thin, chemically-etched dies to leave you with a perfect, defined cut.

The die brush is designed with a sleek, ergonomic rubber-grip handle to prevent slippage and allow for easy manoeuvrability. Also included is a foam mat that provides the ideal surface on which to remove the excess paper from the dies and the cutout.

  • Brush size: 14 x 4.4 cm (5 ½ x 1 ¾ inches)
  • Foam pad size: 4 ½ inches x 7 ¼ inches
  • Includes 1 die brush, 1 foam pad
  • Cleans Framelits, Thinlits and Triplits Dies

Sizzix Die Brush and Foam Pad for Wafer-Thin Dies

Product code: 6178441000

Delivery and returns

FREE standard UK delivery
In 3 working days (Monday to Saturday) on orders of £20 and over.
FREE
Click and Collect
Order by 8pm Sunday to Friday and collect next day.
Order on Saturday and collect on Monday.
*Minimum order £10..
FREE*
Standard UK delivery
In 3 working days (Monday to Saturday) on orders under £20.
£4.50
Next Day UK delivery
Order by 8pm Monday to Saturday for delivery the next working day. Order by 8pm Sunday for delivery on Tuesday.
£6.50
FREE UK returns
We don't believe that you should have to pay for return postage.
International delivery
Now available More details >

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